Patent Assignment
Reel/Frame 014736/0880
Assignment of Assignor's Interest
Recorded: 2003-11-20
Pages: 4
Assignors
URAGAMI, HIROSHI
Executed: 2003-11-05
NAKAGAWA, OSAMU
Executed: 2003-11-05
FUJINO, KINYA
Executed: 2003-11-05
TAKASE, SHINJI
Executed: 2003-11-05
TOKUYAMA, HIDEKI
Executed: 2003-11-05
MEGURO, KOICHI
Executed: 2003-11-12
NISHINO, TORU
Executed: 2003-11-12
HAYASAKA, NOBORU
Executed: 2003-11-12
Assignees
TOWA CORPORATION
5, KAMITOBA KAMICHOSHI-CHO MINAMI-KU, KYOTO-SHI, KYOTO, JAPAN
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property
(1)
Method of Resin Encapsulation, Apparatus for Resin Encapsulation, Method of Manufacturing Semiconductor Device, Semiconductor Device and Resin Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Aug 3, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024776/0288 →
Assignment of Assignor's Interest
Feb 22, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 037786/0316 →