IP Library › Assignment 024776/0288
Patent Assignment
Reel/Frame 024776/0288

Change of Name

Recorded: 2010-08-03 Pages: 8
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Method of Resin Encapsulation, Apparatus for Resin Encapsulation, Method of Manufacturing Semiconductor Device, Semiconductor Device and Resin Material
Patent: 7,056,770 →
Application: 10/719,379 →
Publication: US 2004/0101631
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 20, 2003
From: URAGAMI, HIROSHI; NAKAGAWA, OSAMU; FUJINO, KINYA; TAKASE, SHINJI
To: TOWA CORPORATION; FUJITSU LIMITED
Reel/Frame 014736/0880 →
Assignment of Assignor's Interest Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Assignment of Assignor's Interest Feb 22, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 037786/0316 →