Patent Assignment
Reel/Frame 037786/0316
Assignment of Assignor's Interest
Recorded: 2016-02-22
Pages: 2
Assignor
FUJITSU SEMICONDUCTOR LIMITED
Executed: 2016-01-29
Assignee
SOCIONEXT INC.
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Method of Resin Encapsulation, Apparatus for Resin Encapsulation, Method of Manufacturing Semiconductor Device, Semiconductor Device and Resin Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 20, 2003
From: URAGAMI, HIROSHI; NAKAGAWA, OSAMU; FUJINO, KINYA; TAKASE, SHINJI
To: TOWA CORPORATION; FUJITSU LIMITED
Reel/Frame 014736/0880 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Aug 3, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024776/0288 →