IP Library › Assignment 015084/0231
Patent Assignment
Reel/Frame 015084/0231

Assignment of Assignor's Interest

Recorded: 2004-08-25 Pages: 4
Assignors
MIS, J. DANIEL
Executed: 2004-07-13
ZEHNDER, DEAN
Executed: 2004-07-13
Assignee
UNITIVE INTERNATIONAL LIMITED
CARACASBAAIWEG 201, CURACAO, NETHERLANDS ANTILLES
Covered Property (1)
Methods of Forming Conductive Structures Including Titanium-Tungsten Base Layers and Related Structures
Patent: 7,244,671 →
Application: 10/879,411 →
Publication: US 2005/0020047
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Effective 11/01/2012 Jan 9, 2013
From: UNITIVE INTERNATIONAL, LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 029597/0452 →
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →