Patent Assignment
Reel/Frame 015401/0995
Assignment of Assignor's Interest
Recorded: 2004-06-01
Pages: 4
Assignors
FUJISAWA, TADAHITO
Executed: 2004-02-27
INOUE, SOICHI
Executed: 2004-02-27
KOBAYASHI, MAKOTO
Executed: 2004-02-27
ICHIKAWA, MASASHI
Executed: 2004-02-27
HAGIWARA, TSUNEYUKI
Executed: 2004-01-07
KODAMA, KENICHI
Executed: 2003-12-22
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
SHIN-ETSU HANDOTAI CO., LTD.
4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-8331, JAPAN
NIKON CORPORATION
2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN
Covered Property
(1)
Wafer Flatness Evaluation Method, Wafer Flatness Evaluation Apparatus Carrying Out the Evaluation Method, Wafer Manufacturing Method Using the Evaluation Method, Wafer Quality Assurance Method Using the Evaluation Method, Semiconductor Device Manufacturing Method U
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 13, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 044384/0054 →
Merger and Change of Name
Jan 20, 2022
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058785/0124 →
Change of Name
Jan 20, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058785/0197 →