Patent Assignment
Reel/Frame 044384/0054
Assignment of Assignor's Interest
Recorded: 2017-12-13
Pages: 2
Assignor
KABUSHIKI KAISHA TOSHIBA
Executed: 2017-12-05
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Properties
(3)
Wafer Flatness Evaluation Method, Wafer Flatness Evaluation Apparatus Carrying Out the Evaluation Method, Wafer Manufacturing Method Using the Evaluation Method, Wafer Quality Assurance Method Using the Evaluation Method, Semiconductor Device Manufacturing Method U
Wafer Flatness Evaluation Method, Wafer Flatness Evaluation Apparatus Carrying Out the Evaluation Method, Wafer Manufacturing Method Using the Evaluation Method, Wafer Quality Assurance Method Using the Evaluation Method, Semiconductor Device Manufacturing Method U
Wafer Flatness Evaluation Method, Wafer Flatness Evaluation Apparatus Carrying Out the Evaluation Method, Wafer Manufacturing Method Using the Evaluation Method, Wafer Quality Assurance Method Using the Evaluation Method, Semiconductor Device Manufacturing Method U
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.