IP Library › Assignment 015421/0279
Patent Assignment
Reel/Frame 015421/0279

Assignment of Assignor's Interest

Recorded: 2004-12-02 Pages: 3
Assignors
CHEN, HOWARD HAO
Executed: 2004-11-01
HSU, LOUIS LU-CHEN
Executed: 2004-11-05
Assignee
Covered Property (1)
Device and Method for Fabricating Double-Sided Soi Wafer Scale Package with Through via Connections
Patent: 7,098,070 →
Application: 10/990,252 →
Publication: US 2006/0105496
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →