Patent Assignment
Reel/Frame 015462/0684
Assignment of Assignor's Interest
Recorded: 2004-06-14
Pages: 6
Assignors
JAN, JONG-RONG
Executed: 2004-02-18
LU, TSAI-HUA
Executed: 2004-02-18
CHIU, SAO-LING
Executed: 2004-02-18
KUNG, LING-CHEN
Executed: 2004-02-18
Assignee
UNITIVE ELECTRONICS INC.
140 SOUTHCENTER COURT, MORRISVILLE, NORTH CAROLINA, 27560
Covered Property
(1)
Methods of Selectively Bumping Integrated Circuit Substrates and Related Structures
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 23, 2006
From: UNITIVE ELECTRONICS INC.
To: UNITIVE INTERNATIONAL LIMITED
Reel/Frame 017846/0057 →
Nunc Pro Tunc Assignment Effective 11/01/2012
Jan 9, 2013
From: UNITIVE INTERNATIONAL, LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 029597/0452 →
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →