Patent Assignment
Reel/Frame 015546/0185
Assignment of Assignor's Interest
Recorded: 2004-06-30
Pages: 3
Assignor
KIM, SANG-YOUNG
Executed: 2004-06-28
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, 467-86, KOREA, REPUBLIC OF
Covered Property
(1)
Test Pattern for Reliability Measurement of Copper Interconnection Line Having Moisture Window and Method for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 5, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023056/0279 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name
Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →