Patent Assignment
Reel/Frame 023056/0279
Assignment of Assignor's Interest
Recorded: 2009-08-05
Pages: 4
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2009-07-30
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Properties
(11)
Stacked Semiconductor Package and Fabricating Method Thereof
Patent:
6,344,683 →
Application:
09/393,184 →
Method of Forming Metal Line Layer in Semiconductor Device
Semiconductor Device and Method of Fabricating the Same
Multi-Level Voltage Output Control Circuit and Logic Gate Therefor
A Transistor in a Semiconductor Substrate Having High-Concentration Source and Drain Region Formed at the Bottom of a Trench Adjacent to the Gate Electrode.
Method for Forming Inductor in Semiconductor Device
Method for Forming Metal Wires in Semiconductor Device
Method for Forming Inductor in Semiconductor Device
Method of Manufacturing Semiconductor Device
Radio Frequency Integrated Circuit, and Method for Manufacturing the Same
Test Pattern for Reliability Measurement of Copper Interconnection Line Having Moisture Window and Method for Manufacturing the Same
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2003
From: LEE, JOON HYEON
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 014756/0958 →
Assignment of Assignor's Interest
Jun 25, 2004
From: LIM, DAE-HO
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015519/0964 →
Assignment of Assignor's Interest
Jun 28, 2004
From: PARK, NAM KYU
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015522/0087 →
Assignment of Assignor's Interest
Jun 29, 2004
From: PYO, SUNG GYU
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015525/0412 →
Assignment of Assignor's Interest
Jun 29, 2004
From: PARK, SANG KYUN
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015534/0054 →
Assignment of Assignor's Interest
Jun 29, 2004
From: PARK, SANG KYUN; SHIN, CHAN SOO
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015557/0399 →
Assignment of Assignor's Interest
Jun 29, 2004
From: CHO, IHL HYUN
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015536/0445 →
Assignment of Assignor's Interest
Jun 30, 2004
From: KIM, SANG-YOUNG
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015546/0185 →
Assignment of Assignor's Interest
Aug 25, 2004
From: MIN, WOO SIG
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015730/0291 →
Change of Name
Nov 1, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0529 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name
Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →
Nunc Pro Tunc Assignment
Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Release of Security Interest
Mar 13, 2025
From: BANK OF MONTREAL
To: WORKFUSION, INC.
Reel/Frame 070501/0409 →