Patent Assignment
Reel/Frame 015554/0914
Assignment of Assignor's Interest
Recorded: 2004-07-01
Pages: 2
Assignors
RYU, DONG SU
Executed: 2004-07-01
PARK, DOO HYUN
Executed: 2004-07-01
KIM, HO SEOK
Executed: 2004-07-01
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Substrate for Semiconductor Package and Wire Bonding Method Using Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Feb 27, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017215/0953 →
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →