IP Library › Assignment 017215/0953
Patent Assignment
Reel/Frame 017215/0953

Security Agreement

Recorded: 2006-02-27 Pages: 9
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2006-02-10
Assignee
BANK OF AMERICA, N.A.
901 MAIN STREET, 22ND FLOOR, DALLAS, TEXAS, 75202
Covered Properties (18)
Structure of Heat Slug-Equipped Packages and the Packaging Method of the Same
Patent: 6,963,141 →
Application: 09/746,018 →
Publication: US 2001/0019181
Pattern Recognition Method
Patent: 6,990,226 →
Application: 09/758,325 →
Publication: US 2001/0051000
Clamp for Pattern Recognition
Patent: 6,984,879 →
Application: 09/758,332 →
Publication: US 2001/0053244
Imprinted Integrated Circuit Substrate and Method for Imprinting an Integrated Circuit Substrate
Patent: 6,967,124 →
Application: 09/884,193 →
Stacking Structure for Semiconductor Chips and a Semiconductor Package Using It
Patent: 6,982,485 →
Application: 10/076,701 →
Method of Making Near Chip Size Integrated Circuit Package
Patent: 6,962,829 →
Application: 10/150,400 →
Publication: US 2002/0168798
Method of making an integrated circuit package
Application: 10/156,889 →
Publication: US 2002/0144396
Optic Semiconductor Module and Manufacturing Method
Patent: 7,146,106 →
Application: 10/227,051 →
Publication: US 2004/0036135
Reinforced Lead-Frame Assembly for Interconnecting Circuits Within a Circuit Module
Patent: 6,965,159 →
Application: 10/356,997 →
Semiconductor Package and Method for Fabricating the Same
Patent: 6,982,488 →
Application: 10/600,931 →
Publication: US 2004/0007771
Mounting for a Package Containing a Chip
Patent: 6,967,395 →
Application: 10/688,138 →
Stackable Semiconductor Package and Manufacturing Method Thereof
Patent: 6,977,431 →
Application: 10/702,274 →
Semiconductor Package with Exposed Die Pad and Body-Locking Leadframe
Patent: 6,965,157 →
Application: 10/737,572 →
Semiconductor Package and Method for Fabricating the Same
Patent: 7,190,071 →
Application: 10/785,528 →
Publication: US 2004/0164411
Stackable Semiconductor Package Having Semiconductor Chip Within Central Through Hole of Substrate
Patent: 7,061,120 →
Application: 10/803,333 →
Publication: US 2004/0175916
Substrate for Semiconductor Package and Wire Bonding Method Using Thereof
Patent: 7,030,508 →
Application: 10/884,082 →
Publication: US 2005/0001299
Image Sensor Package Fabrication Method
Patent: 6,956,201 →
Application: 10/928,475 →
Publication: US 2005/0024752
Semiconductor Package
Patent: 6,953,988 →
Application: 10/944,241 →
Publication: US 2005/0062148
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 26, 2000
From: LEE, JUNG-YU; TZU, CHUNG-HSING
To: SAMPO SEMICONDUCTOR COOPERATION
Reel/Frame 011429/0439 →
Invalid Recording. Document Re-Recorded to Correct the Recordation Date. See Document at Reel 11616, Frame 0635. Jan 1, 2001
From: KIM, SONG HAK; CHO, HUN KIL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 011459/0722 →
(Assignment of Assignor's Interest) Re-Record to Correct the Recordation Date of 01/01/2001 to 01/10/2001, Recorded on Reel 11459 Frame 0722. Jan 10, 2001
From: KIM, SONG HAK; CHO, HUN KIL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 011616/0635 →
Assignment of Assignor's Interest Jan 10, 2001
From: KIM, SONG HAK; CHO, HUN KIL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 011477/0358 →
Assignment of Assignor's Interest Jun 19, 2001
From: HUEMOELLER, RONALD PATRICK; RUSLI, SUKIANTO
To: AMKOR TECHNOLOGY
Reel/Frame 011918/0682 →
Assignment of Assignor's Interest Feb 13, 2002
From: LEE, SEON GOO; KIM, YOUNG HO; LEE, CHOON HEUNG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 012603/0702 →
Assignment of Assignor's Interest Apr 8, 2002
From: HUEMOELLER, RONALD PATRICK; RUSLI, SUKIANTO
To: AMKOR TECHNOLOGY
Reel/Frame 012797/0439 →
Change of Name May 30, 2002
From: SAMPO SEMICONDUCTOR CORPORATION
To: AMKOR TECHNOLOGY TAIWAN (LUNG TAN) LTD.
Reel/Frame 012944/0784 →
Corrective to Correct Assignee Previously Recorded Reel/Frame 012797/0439 Jul 5, 2002
From: HUEMOELLER, RONALD PATRICK; RUSLI, SUKIANTO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013054/0933 →
Assignment of Assignor's Interest Aug 23, 2002
From: YANG, JUN YOUNG; LEE, SANG HO; PARK, CHUL WOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013236/0224 →
Assignment of Assignor's Interest Feb 3, 2003
From: MIKS, JEFFREY ALAN; MIRANDA, JOHN ARMANDO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013730/0527 →
Assignment of Assignor's Interest Nov 5, 2003
From: OH, KWANG SEOK; MOON, DOO HWAN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 014682/0643 →
Assignment of Assignor's Interest Jul 1, 2004
From: RYU, DONG SU; PARK, DOO HYUN; KIM, HO SEOK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015554/0914 →
Assignment of Assignor's Interest Nov 15, 2004
From: AMKOR TECHNOLOGY TAIWAN LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015376/0444 →
Assignment of Assignor's Interest May 16, 2005
From: AMKOR TECHNOLOGY KOREA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 016558/0625 →
Assignment of Assignor's Interest May 16, 2005
From: ANAM SEMICONDUCTOR, INC.
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 016558/0618 →
Patent Security Agreement Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
Assignment of Assignor's Interest Jan 9, 2024
From: WEBSTER, STEVEN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066061/0189 →