IP Library › Assignment 015376/0444
Patent Assignment
Reel/Frame 015376/0444

Assignment of Assignor's Interest

Recorded: 2004-11-15 Pages: 2
Assignor
AMKOR TECHNOLOGY TAIWAN LTD.
Executed: 2004-09-17
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property (1)
Structure of Heat Slug-Equipped Packages and the Packaging Method of the Same
Patent: 6,963,141 →
Application: 09/746,018 →
Publication: US 2001/0019181
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 26, 2000
From: LEE, JUNG-YU; TZU, CHUNG-HSING
To: SAMPO SEMICONDUCTOR COOPERATION
Reel/Frame 011429/0439 →
Change of Name May 30, 2002
From: SAMPO SEMICONDUCTOR CORPORATION
To: AMKOR TECHNOLOGY TAIWAN (LUNG TAN) LTD.
Reel/Frame 012944/0784 →
Security Agreement Feb 27, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017215/0953 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →