Patent Assignment
Reel/Frame 011429/0439
Assignment of Assignor's Interest
Recorded: 2000-12-26
Pages: 3
Assignee
SAMPO SEMICONDUCTOR COOPERATION
1F. NO. 1, KAO PING TUAN, CHUNG FENG RD., LUNG TANG HSIANG, TAOYUAN HSIEN, R.O.C, TAIWAN
Covered Property
(1)
Structure of Heat Slug-Equipped Packages and the Packaging Method of the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 30, 2002
From: SAMPO SEMICONDUCTOR CORPORATION
To: AMKOR TECHNOLOGY TAIWAN (LUNG TAN) LTD.
Reel/Frame 012944/0784 →
Assignment of Assignor's Interest
Nov 15, 2004
From: AMKOR TECHNOLOGY TAIWAN LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015376/0444 →
Security Agreement
Feb 27, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017215/0953 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →