Patent Assignment
Reel/Frame 012944/0784
Change of Name
Recorded: 2002-05-30
Pages: 11
Assignor
SAMPO SEMICONDUCTOR CORPORATION
Executed: 2001-11-28
Assignee
AMKOR TECHNOLOGY TAIWAN (LUNG TAN) LTD.
15/F, 168 TUN HUAN N. RD., TAIPEI, R.O.C, TAIWAN
Covered Property
(1)
Structure of Heat Slug-Equipped Packages and the Packaging Method of the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 26, 2000
From: LEE, JUNG-YU; TZU, CHUNG-HSING
To: SAMPO SEMICONDUCTOR COOPERATION
Reel/Frame 011429/0439 →
Assignment of Assignor's Interest
Nov 15, 2004
From: AMKOR TECHNOLOGY TAIWAN LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015376/0444 →
Security Agreement
Feb 27, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017215/0953 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →