IP Library › Assignment 016558/0618
Patent Assignment
Reel/Frame 016558/0618

Assignment of Assignor's Interest

Recorded: 2005-05-16 Pages: 2
Assignor
ANAM SEMICONDUCTOR, INC.
Executed: 2004-10-12
Assignee
AMKOR TECHNOLOGY KOREA, INC.
280-8, 2-GA, SEONGSU-DONG, SEONGDONG-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Method for Fabricating the Same
Patent: 7,190,071 →
Application: 10/785,528 →
Publication: US 2004/0164411
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 16, 2005
From: AMKOR TECHNOLOGY KOREA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 016558/0625 →
Security Agreement Feb 27, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017215/0953 →
Patent Security Agreement Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →