IP Library › Assignment 015715/0144
Patent Assignment
Reel/Frame 015715/0144

Assignment of Assignor's Interest

Recorded: 2004-08-20 Pages: 5
Assignor
Assignee
HIGH VOLTAGE ENGINEERING CORPORATION
491 EDGEWATER PLACE, SUITE 680, WAKEFIELD, MASSACHUSETTS, 01880-6210
Covered Property (1)
System and Method for Depth Profiling and Characterization of Thin Films
Patent: 7,449,682 →
Application: 10/493,492 →
Publication: US 2004/0238735
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 20, 2004
From: HIGH VOLTAGE ENGINEERING CORP. (ASSET SALE AGREEMENT)
To: REVERA INCORPORATED
Reel/Frame 015715/0042 →
Security Interest Nov 19, 2008
From: REVERA INCORPORATED
To: VENTURE LENDING & LEASING V, INC.
Reel/Frame 021876/0706 →
Security Agreement Apr 27, 2010
From: REVERA INCORPORATED
To: SILICON VALLEY BANK
Reel/Frame 024294/0741 →
Release of Security Interest Mar 31, 2015
From: VENTURE LENDING & LEASING V, LLC
To: REVERA INCORPORATED
Reel/Frame 035299/0001 →
Release of Security Interest Apr 3, 2015
From: SILICON VALLEY BANK
To: REVERA INCORPORATED
Reel/Frame 035333/0150 →
Merger Jan 23, 2018
From: REVERA INCORPORATED
To: NOVA MEASURING INSTRUMENTS INC.
Reel/Frame 044706/0656 →