IP Library › Assignment 024294/0741
Patent Assignment
Reel/Frame 024294/0741

Security Agreement

Recorded: 2010-04-27 Pages: 11
Assignor
REVERA INCORPORATED
Executed: 2010-04-27
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (31)
Direct Imaging Monochromatic Electron Microscope
Patent: 4,810,880 →
Application: 07/058,437 →
Energy and Analysis Detection System for Surface Chemical Analysis
Patent: 4,737,639 →
Application: 07/063,806 →
Resistive Anode Encoder Target and Method Producing Both Charged and Visual Images
Patent: 5,025,144 →
Application: 07/254,442 →
Direct Imaging Monochromatic Electron Microscope
Patent: 4,882,487 →
Application: 07/268,440 →
Particle Analyzer Apparatus and Method
Patent: 5,128,543 →
Application: 07/425,568 →
Multichannel Charged-Particle Analyzer
Patent: 5,032,724 →
Application: 07/565,289 →
Plasma Etching Method and Apparatus
Patent: 5,167,748 →
Application: 07/579,331 →
Apparatus and Method for Locating Target Area for Electron Micro- Analysis
Patent: 5,118,941 →
Application: 07/690,870 →
Suspension System for Isolating Vibrations
Patent: 5,213,301 →
Application: 07/809,691 →
Apparatus for Retaining an Electrode by a Magnetically Shielded Magnet
Patent: 5,218,262 →
Application: 07/863,640 →
Mechanism for Positioning a Carrier
Patent: 5,184,525 →
Application: 07/869,561 →
Scanning and High Resolution X-Ray Photoelectron Spectroscopy and Imaging
Patent: 5,315,113 →
Application: 07/953,429 →
Method and Apparatus for Control of Surface Potential
Patent: 5,432,345 →
Application: 07/958,249 →
Scanning and High Resolution Electron Spectroscopy and Imaging
Patent: 5,444,242 →
Application: 08/201,912 →
Anode Assembly for Generating X-Rays and Instrument with Such Anode Assembly
Patent: 5,602,899 →
Application: 08/593,308 →
Focused Ion Beam Column with Electrically Variable Blanking Aperture
Patent: 5,637,879 →
Application: 08/618,599 →
Control of Surface Potential of Insulating Specimens in Surface Analysis
Patent: 5,990,476 →
Application: 08/968,454 →
Nondestructive Characterization of Thin Films Based on Acquired Spectrum
Patent: 6,891,158 →
Application: 10/330,317 →
Publication: US 2004/0125913
Nondestructive Characterization of Thin Films Using Measured Basis Spectra
Patent: 6,800,852 →
Application: 10/330,383 →
Publication: US 2004/0135081
System and Method for Depth Profiling and Characterization of Thin Films
Patent: 7,449,682 →
Application: 10/493,492 →
Publication: US 2004/0238735
Electronic Device Incorporating a Multilayered Capacitor Formed on a Printed Circuit Board
Patent: 7,561,438 →
Application: 11/023,271 →
Semiconductor Substrate Processing Method and Apparatus
Patent: 7,720,631 →
Application: 11/040,329 →
Publication: US 2006/0190916
Determining Layer Thickness Using Photoelectron Spectroscopy
Patent: 7,420,163 →
Application: 11/118,035 →
Publication: US 2006/0243904
Techniques for Analyzing Data Generated by Instruments
Patent: 7,231,324 →
Application: 11/118,683 →
Publication: US 2006/0247899
Method and System for Non-Destructive Distribution Profiling of an Element in a Film
Patent: 7,411,188 →
Application: 11/218,114 →
Publication: US 2007/0010973
Diamond Anode
Patent: 7,359,487 →
Application: 11/228,685 →
Photoelectron Spectroscopy Apparatus and Method of Use
Patent: 7,399,963 →
Application: 11/237,041 →
Publication: US 2007/0069125
Calibrating Multiple Photoelectron Spectroscopy Systems
Patent: 7,456,399 →
Application: 11/395,189 →
Method and System for Non-Destructive Distribution Profiling of an Element in a Film
Patent: 7,884,321 →
Application: 12/220,645 →
Publication: US 2008/0283743
Method and System for Calibrating an X-Ray Photoelectron Spectroscopy Measurement
Patent: 8,011,830 →
Application: 12/430,687 →
Publication: US 2009/0268877
Method and System for Calibrating an X-Ray Photoelectron Spectroscopy Measurement
Application: 61/048,811 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2004
From: HIGH VOLTAGE ENGINEERING (HVE) (PHYSICAL ELECTRONICS IS A SUBSIDIARY OF HVE)
To: REVERA INCORPORATED
Reel/Frame 015651/0377 →
Merger Aug 20, 2004
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015711/0426 →
Merger Aug 20, 2004
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORP.
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015722/0287 →
Assignment of Assignor's Interest Aug 20, 2004
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015715/0144 →
Merger Aug 20, 2004
From: PHYSICAL ELECTRONIC, INC.
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015711/0430 →
Merger Aug 20, 2004
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015711/0435 →
Assignment of Assignor's Interest Aug 20, 2004
From: HIGH VOLTAGE ENGINEERING CORP. (ASSET SALE AGREEMENT)
To: REVERA INCORPORATED
Reel/Frame 015711/0439 →
Merger Aug 20, 2004
From: PHYSICAL ELECTRONICS, INC.
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015711/0173 →
Assignment of Assignor's Interest Aug 20, 2004
From: HIGH VOLTAGE ENGINEERING CORP. (ASSET SALE)
To: REVERA INCORPORATED
Reel/Frame 015722/0254 →
Assignment of Assignor's Interest Aug 20, 2004
From: HIGH VOLTAGE ENGINEERING CORP.
To: REVERA INCORPORATED
Reel/Frame 015715/0149 →
Merger Aug 20, 2004
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015715/0075 →
Assignment of Assignor's Interest Aug 20, 2004
From: HIGH VOLTAGE ENGINEERING CORP.
To: REVERA INCORPORATED
Reel/Frame 015715/0599 →
Assignment of Assignor's Interest Aug 20, 2004
From: HIGH VOLTAGE ENGINEERING CORP. (ASSET SALE AGREEMENT)
To: REVERA INCORPORATED
Reel/Frame 015715/0042 →
Merger Sep 23, 2004
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015819/0545 →
Assignment of Assignor's Interest Sep 23, 2004
From: HIGH VOLTAGE ENGINEERING CORP. (ASSET SALE AGREEMENT)
To: REVERA INCORPORATED
Reel/Frame 015819/0550 →
Assignment of Assignor's Interest Dec 22, 2004
From: LIU, YUNGMAN
To: REVERA, INCORPORATED
Reel/Frame 016138/0917 →
Assignment of Assignor's Interest Jan 20, 2005
From: PIKE, ALGER C.
To: REVERA, INCORPORATED
Reel/Frame 016211/0538 →
Merger Feb 18, 2005
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015747/0639 →
Merger Feb 18, 2005
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015747/0739 →
Merger Feb 18, 2005
From: PHYSICAL ELECTRIC, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015747/0787 →
Assignment of Assignor's Interest Feb 18, 2005
From: HIGH VOLTAGE ENGINEERING (HVE) (PHYSICAL ELECTRONICS IS A SUBSIDIARY OF HVE)
To: REVERA INCORPORATED
Reel/Frame 015747/0792 →
Merger Feb 18, 2005
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015747/0863 →
Assignment of Assignor's Interest Feb 18, 2005
From: HIGH VOLTAGE ENGINEERING (HVE) (PHYSICAL ELECTRONICS IS A SUBSIDIARY OF HVE)
To: REVERA INCORPORATED
Reel/Frame 015747/0752 →
Merger Feb 18, 2005
From: PHYSICAL ELECTRONICS, INC. MERGED WITH HIGH VOLTAGE ENGINEERING CORPORATION
To: HIGH VOLTAGE ENGINEERING CORPORATION
Reel/Frame 015747/0381 →
Assignment of Assignor's Interest Feb 18, 2005
From: HIGH VOLTAGE ENGINEERING (HVE) (PHYSICAL ELECTRONICS IS A SUBSIDIARY OF HVE)
To: REVERA INCORPORATED
Reel/Frame 015747/0536 →