IP Library Assignment 015747/0639
Patent Assignment
Reel/Frame 015747/0639

Merger

Recorded: 2005-02-18 Pages: 5
Assignor
Assignee
HIGH VOLTAGE ENGINEERING CORPORATION
491 EDGEWATER PLACE, SUITE 680, WAKEFIELD, MASSACHUSETTS, 01880-6210
Covered Property (1)
Plasma Etching Method and Apparatus
Patent: 5,167,748 →
Application: 07/579,331 →
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 22, 2005
From: HIGH VOLTAGE ENGINEERING (HVE) (PHYSICAL ELECTRONICS IS A SUBSIDIARY OF HVE)
To: REVERA INCORPORATED
Reel/Frame 015756/0449 →
Security Interest Nov 19, 2008
From: REVERA INCORPORATED
To: VENTURE LENDING & LEASING V, INC.
Reel/Frame 021876/0706 →
Security Agreement Apr 27, 2010
From: REVERA INCORPORATED
To: SILICON VALLEY BANK
Reel/Frame 024294/0741 →
Release of Security Interest Mar 31, 2015
From: VENTURE LENDING & LEASING V, LLC
To: REVERA INCORPORATED
Reel/Frame 035299/0001 →
Release of Security Interest Apr 3, 2015
From: SILICON VALLEY BANK
To: REVERA INCORPORATED
Reel/Frame 035333/0150 →
Merger Jan 24, 2018
From: REVERA INCORPORATED
To: NOVA MEASURING INSTRUMENTS INC.
Reel/Frame 044720/0019 →