Patent Assignment
Reel/Frame 015737/0895
Assignment of Assignor's Interest
Recorded: 2005-02-17
Pages: 3
Assignors
CHU, JACK O.
Executed: 2004-09-07
COBB, MICHAEL A.
Executed: 2004-09-02
SAUNDERS, PHILIP A.
Executed: 2004-09-03
SHI, LEATHEN
Executed: 2004-09-03
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method of Creating Defect Free High Ge Content (>25%) Sige-on-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License
Oct 27, 2010
From: IBM
To: UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY
Reel/Frame 025207/0521 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →