Patent Assignment
Reel/Frame 015790/0571
Assignment of Assignor's Interest
Recorded: 2005-03-17
Pages: 3
Assignor
YOU YANG, ONG
Executed: 2005-03-15
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Die Attach by Temperature Gradient Lead Free Soft Solder Metal Sheet or Film
Die attach by temperature gradient lead free soft solder metal sheet or film
Application:
60/533,955 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →