Patent Assignment
Reel/Frame 015958/0978
Assignment of Assignor's Interest
Recorded: 2005-04-28
Pages: 3
Assignors
SHIM, IL KWON
Executed: 2005-04-20
ALVAREZ, SHELIA MARIE L.
Executed: 2005-04-20
MAGNO, SHEILA RIMA C.
Executed: 2005-04-20
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Package with Controlled Solder Bump Wetting and Fabrication Method Therefor
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0343 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Corrective Assignment to Correct the Receiving Party Data from Stats Cippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 38378 Frame: 343. Assignor(S) Hereby Confirms the Change of Name.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067556/0746 →