IP Library › Assignment 016072/0714
Patent Assignment
Reel/Frame 016072/0714

Assignment of Assignor's Interest

Recorded: 2005-05-31 Pages: 3
Assignors
HUANG, MIN-SAN
Executed: 2005-02-17
LAI, LEON
Executed: 2005-02-17
WANG, PIN-YAO
Executed: 2005-02-17
Assignee
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN RD. I SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Method of Forming Contact Hole and Method of Fabricating Semiconductor Device
Patent: 7,098,124 →
Application: 10/908,871 →
Publication: US 2006/0134910
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0267 →
Assignment of Assignor's Interest Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049747/0017 →
Assignment of Assignor's Interest Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →