Patent Assignment
Reel/Frame 016132/0926
Assignment of Assignor's Interest
Recorded: 2004-12-30
Pages: 2
Assignor
LEE, SANG YONG
Executed: 2004-12-30
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG, GAGNAM-GU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Shallow Trench Isolation Structure and Formation Method Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 15, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017616/0966 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →