Patent Assignment
Reel/Frame 016139/0811
Assignment of Assignor's Interest
Recorded: 2004-12-30
Pages: 3
Assignor
LEE, KANG-HYUN
Executed: 2004-12-27
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Dual Damascene Interconnection in Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 23, 2006
From: DONGBU-ANAM SEMICONDUCTOR, INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017663/0468 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →