Patent Assignment
Reel/Frame 016498/0211
Assignment of Assignor's Interest
Recorded: 2005-04-26
Pages: 10
Assignor
DONGBU ELECTRONICS CO., LTD.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Properties
(5)
Complementary Metal Oxide Semiconductor Image Sensor Having Cross Talk Prevention and Method for Fabricating the Same
Method for Fabricating a Semiconductor Device
Semiconductor device and a method for fabricating the semiconductor device
Application:
10/954,488 →
Publication:
US 2005/0074949
Cmos Image Sensor and Manufacturing Method Thereof
Embedded non-volatile memory and a method for fabricating the same
Application:
10/969,995 →
Publication:
US 2005/0087793
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2004
From: JUNG, SUNG MUN; KIM, JUM SOO
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015863/0708 →
Assignment of Assignor's Interest
Oct 1, 2004
From: JUNG, SUNG MUN; KIM, DONG OOG
To: DONGU ELECTRONICS CO., LTD.
Reel/Frame 015863/0763 →
Assignment of Assignor's Interest
Oct 1, 2004
From: JEON, IN-GYUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015863/0713 →
Assignment of Assignor's Interest
Oct 1, 2004
From: JEON, IN-GYUN
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015858/0549 →
Assignment of Assignor's Interest
Oct 22, 2004
From: JUNG, SUNG-MUN; KIM, DONG-OOG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015924/0451 →
Change of Name
Jul 12, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018094/0024 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →