Patent Assignment
Reel/Frame 016519/0904
Assignment of Assignor's Interest
Recorded: 2005-04-26
Pages: 3
Assignors
PAEK, JONG SIK
Executed: 2005-04-14
PARK, SUNG SU
Executed: 2005-04-14
SEO, SEONG MIN
Executed: 2005-04-14
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Wafer Level Chip Scale Package and Manufacturing Method for the Same
Patent:
7,446,422 →
Application:
11/115,579 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →