IP Library › Assignment 016571/0462
Patent Assignment
Reel/Frame 016571/0462

Assignment of Assignor's Interest

Recorded: 2005-05-18 Pages: 3
Assignors
HEDLER, HARRY
Executed: 2002-02-25
HAIMERL, ALFRED
Executed: 2002-01-23
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STRASSE 53, MUENCHEN, 81669, GERMANY
Covered Property (1)
Electronic Component with Flexible Bonding Pads and Method of Producing Such a Component
Patent: 6,956,287 →
Application: 10/022,226 →
Publication: US 2002/0089058
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 12, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023768/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Aug 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036396/0646 →