Electronic component with flexible bonding pads and method of producing such a component

1. An electronic component, comprising:

an electronic circuit having a first surface;

electrical contacts at least on said first surface for electrical bonding of said electronic circuit;

at least one elevation disposed on said first surface, said at least one elevation having an elevation surface and a contact zone, said at least one elevation being formed of an insulating material having sufficient flexibility to absorb stresses occurring in said contact zone as a result of at least one of the group consisting of thermal loading and mechanical loading, and said at least one elevation having a geometrical shape for achieving a spring effect in directions extending parallel to said first surface;

at least one of said electrical contacts disposed on said at least one elevation; and

a conduction path disposed on said elevation surface between said at least one of said electrical contacts and said electronic circuit.

2. The electronic component according to claim 1 , including:

an insulating layer at least partially covering said first surface and adjoining said at least one elevation; and

conductor runs disposed on said insulating layer and forming a conducting connection between said at least one elevation and said electronic circuit.

3. The electronic component according to claim 2 , wherein said insulating layer at least partially covers said at least one elevation.

4. The electronic component according to claim 3 , wherein said insulating layer is elastic.

5. The electronic component according to claim 1 , wherein the electronic component is a semiconductor component.

6. The electronic component according to claim 5 , wherein the electronic component is a polymer component.

7. The electronic component according to claim 1 , wherein at least one of said electrical contacts is formed by one of the group consisting of a conducting layer, a conducting pin, and a conducting ball.

8. The electronic component according to claim 1 , wherein said elevation is taller than it is wide.

9. An electronic component, comprising:

an electronic circuit having a first surface;

electrical contacts at least on said first surface for electrical bonding of said electronic circuit;

at least one elevation disposed on said first surface, said at least one elevation having a contact zone and an interior, said at least one elevation being formed of an insulating material having sufficient flexibility to absorb stresses occurring in said contact zone as a result of at least one of the group consisting of thermal loading and mechanical loading;

at least one of said electrical contacts disposed on said at least one elevation; and

a conduction path disposed in said interior between said at least one of said electrical contacts and said electronic circuit.

10. The electronic component according to claim 9 , including:

an insulating layer at least partially covering said first surface and adjoining said at least one elevation; and

conductor runs disposed on said insulating layer and forming a conducting connection between said at least one elevation and said electronic circuit.

11. The electronic component according to claim 10 , wherein said insulating layer at least partially covers said at least one elevation.

12. The electronic component according to claim 11 , wherein said insulating layer is elastic.

13. The electronic component according to claim 9 , wherein the electronic component is a semiconductor component.

14. The electronic component according to claim 13 , wherein the electronic component is a polymer component.

15. The electronic component according to claim 9 , wherein at least one of said electrical contacts is formed by one of the group consisting of a conducting layer, a conducting pin, and a conducting ball.

16. An electronic component, comprising:

an electronic circuit having a first surface;

electrical contacts at least on said first surface for electrical bonding of said electronic circuit;

at least one elevation disposed on said first surface, said at least one elevation having an elevation surface, an outwardly facing side face, and a contact zone, said at least one elevation being formed of an insulating material having sufficient flexibility to absorb stresses occurring in said contact zone as a result of at least one of the group consisting of thermal loading and mechanical loading;

at least one of said electrical contacts disposed on said at least one elevation;

an insulation layer only partially covering said at least one elevation by leaving said side face free of said insulation layer; and

a conduction path at least partly disposed on at least part of said insulating layer partially covering said at least one elevation between said at least one of said electrical contacts and said electronic circuit.

17. The electronic component according to claim 16 , wherein:

said insulating layer has rough regions;

at least one of said electrical contacts is disposed on said rough regions of said insulating layer; and

a conduction path is disposed on said rough regions of said insulating surface between said at least one of said electrical contacts and said electrical circuit.

18. An electronic component, comprising:

an electronic circuit having a first surface;

electrical contacts at least on said first surface for electrical bonding of said electronic circuit;

at least one elevation disposed on said first surface, said at least one elevation including an elevation surface having rough regions and a contact zone, said at least one elevation being formed of an insulating material having sufficient flexibility to absorb stresses occurring in said contact zone as a result of at least one of the group consisting of thermal loading and mechanical loading;

at least one of said electrical contacts disposed on said rough regions of said elevation surface; and

a conduction path disposed on said rough regions of said elevation surface between said at least one of said electrical contacts and said electronic circuit.

19. The electronic component according to claim 18 , wherein said rough regions include nuclei.

20. The electronic component according to claim 19 , wherein the nuclei are palladium.