IP Library › Assignment 016600/0861
Patent Assignment
Reel/Frame 016600/0861

Assignment of Assignor's Interest

Recorded: 2005-05-24 Pages: 3
Assignors
PRENGEL, HELMUT
Executed: 2004-10-26
SCHNEIDER, FRANK
Executed: 2004-10-26
Assignee
ADVANCED MICRO DEVICES, INC.
5204 E. BEN WHITE BLVD., AUSTIN, TEXAS, 78741
Covered Property (1)
Chip Bond Layout for Chip Carrier for Flip Chip Applications
Patent: 7,271,495 →
Application: 11/135,720 →
Publication: US 2006/0076691
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →