IP Library › Assignment 016671/0891
Patent Assignment
Reel/Frame 016671/0891

Assignment of Assignor's Interest

Recorded: 2005-10-22 Pages: 3
Assignors
LEE, SEONGMIN
Executed: 2005-10-17
LEE, TAE KEUN
Executed: 2005-10-17
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Integrated Circuit Package System with Heat Slug
Patent: 7,517,729 →
Application: 11/163,559 →
Publication: US 2006/0103009
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 16, 2011
From: LEE, SEONGMIN; LEE, TAE KEUN
To: STATS CHIPPAC LTD.
Reel/Frame 026759/0929 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319) Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →