IP Library › Assignment 016827/0103
Patent Assignment
Reel/Frame 016827/0103

Assignment of Assignor's Interest

Recorded: 2005-08-01 Pages: 5
Assignors
MEYER, THORSTEN
Executed: 2005-07-01
HEDLER, HARRY
Executed: 2005-07-01
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, 81669 MUNCHEN, GERMANY
Covered Property (1)
Method of Manufacturing a Semiconductor Device Comprising Stacked Chips and a Corresponding Semiconductor Device
Patent: 7,208,345 →
Application: 11/126,392 →
Publication: US 2006/0258044
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Sep 28, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036701/0926 →