Patent Assignment
Reel/Frame 016901/0844
Assignment of Assignor's Interest
Recorded: 2005-08-17
Pages: 4
Assignors
CHIA, CHOK J.
Executed: 2005-08-16
LIM, ALLEN SENG SOOI
Executed: 2005-08-16
OTHIENO, MAURICE O.
Executed: 2005-08-16
Assignee
LSI LOGIC CORPORATION
1621 BARBER LANE, LEGAL DEPARTMENT - IP, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Two Layer Substrate Ball Grid Array Design
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 11, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023075/0361 →
Assignment of Assignor's Interest
Sep 29, 2009
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023292/0897 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →