Patent Assignment
Reel/Frame 016976/0480
Assignment of Assignor's Interest
Recorded: 2005-11-03
Pages: 2
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2005-07-07
Assignee
RENESAS TECHNOLOGY CORPORATION
2-4-1, MARUNOUCHI, CHIYODA-KU, TOKYO, 100-6334, JAPAN
Covered Properties
(2)
Wiring Substrate and Process for Producing the Same
Wiring Substrate
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 8, 2000
From: OTSUKA, KANJI; USAMI, TAMOTSU
To: USAMI, TAMOTSU; SANYO ELECTRIC CO., LTD.; OKI ELECTRIC INDUSTRY CO., LTD.; SHARP KABUSHIKI KAISHA
Reel/Frame 011353/0963 →
Re-Record to Correct an Assignee on Reel 011353 Frame 0963. Assignor Hereby Confirms the Assignment of the Entire Interest.
May 29, 2001
From: OTSUKA, KANJI; USAMI, TAMOTSU
To: SANYO ELECTRIC CO., LTD.; OKI ELECTRIC INDUSTRY CO., LTD.; SHARP KABUSHIKI KAISHA; SONY CORPORATION
Reel/Frame 011876/0099 →
Merger
Aug 19, 2004
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 015687/0557 →
Assignment of Assignor's Interest
Nov 3, 2005
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 016976/0263 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Mar 12, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022408/0397 →
Change of Name
Dec 5, 2011
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027327/0143 →
Change of Name
Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Merger and Change of Name
Sep 9, 2014
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 033698/0648 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →