IP Library Assignment 016995/0867
Patent Assignment
Reel/Frame 016995/0867

Assignment of Assignor's Interest

Recorded: 2006-01-10 Pages: 5
Assignors
LEE, HUN-TEAK
Executed: 2006-01-05
KIM, JOON-KOOK
Executed: 2006-01-05
KIM, CHUL-SIK
Executed: 2006-01-05
JANG, KI-YOUN
Executed: 2006-01-05
PENDSE, RAJENDRA D.
Executed: 2005-12-29
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties (2)
Wire Bond Interconnection
Patent: 7,453,156 →
Application: 11/273,635 →
Publication: US 2006/0113665
Ball-contact integrated circuit system
Application: 60/627,650 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Second Inventor's Name from Joon-Kook Kim to Jong-Kook Kim Previously Recorded on Reel 016995 Frame 0867. Assignor(S) Hereby Confirms the Assignment. Feb 22, 2008
From: LEE, HUN-TEAK; KIM, JONG-KOOK; KIM, CHUL-SIK; JANG, KI-YOUN
To: CHIPPAC, INC.
Reel/Frame 020549/0662 →
Merger and Change of Name Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →