IP Library › Assignment 017003/0264
Patent Assignment
Reel/Frame 017003/0264

Assignment of Assignor's Interest

Recorded: 2006-01-11 Pages: 3
Assignor
YIM, CHOONG BIN
Executed: 2005-12-30
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Stacked Integrated Circuit Leadframe Package System
Patent: 7,446,396 →
Application: 11/306,805 →
Publication: US 2007/0108604
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 30, 2008
From: YIM, CHOONG BIN
To: STATS CHIPPAC LTD.
Reel/Frame 021318/0420 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319) Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →