Patent Assignment
Reel/Frame 017038/0079
Assignment of Assignor's Interest
Recorded: 2006-01-19
Pages: 5
Assignors
LEE, JAE SOO
Executed: 2006-01-03
KIM, GEUN SIK
Executed: 2006-01-03
ALVAREZ, SHEILA
Executed: 2006-01-06
QUIAZON, ROBINSON
Executed: 2006-01-06
GOH, HIN HWA
Executed: 2006-01-06
DAHILIG, FREDERICK
Executed: 2006-01-09
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Semiconductor Flip Chip Package Having Substantially Non-Collapsible Spacer
Integrated circuit system with substrate spacer
Application:
60/629,194 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →