Patent Assignment
Reel/Frame 017276/0417
Assignment of Assignor's Interest
Recorded: 2005-11-23
Pages: 2
Assignor
YAMAZAKI, YASUSHI
Executed: 2005-11-18
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having a Bonding Pad Structure Including an Annular Contact
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 15, 2012
From: ELPIDA MEMORY, INC.
To: APPLE INC.
Reel/Frame 028209/0477 →
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Release of Security Interest
Feb 24, 2014
From: APPLE, INC
To: ELPIDA MEMORY, INC.
Reel/Frame 032331/0637 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →
Change of Name
Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest
Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest
Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046867/0248 →