IP Library › Assignment 017318/0374
Patent Assignment
Reel/Frame 017318/0374

Assignment of Assignor's Interest

Recorded: 2005-12-02 Pages: 2
Assignor
LEE, KYE NAM
Executed: 2005-11-28
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, GANGNAM-GU,, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device and Manufacturing Method Thereof
Patent: 7,572,719 →
Application: 11/292,241 →
Publication: US 2006/0118887
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 13, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018099/0256 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →