Patent Assignment
Reel/Frame 017318/0567
Assignment of Assignor's Interest
Recorded: 2005-12-01
Pages: 2
Assignor
LEE, JAE-SUK
Executed: 2005-12-01
Assignee
DONGBUANAM SEMICONDUCTOR, INC.
891-10 DAECHI-SONG KANGNAM-KU, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Methods for Forming a P-Type Polysilicon Layer in a Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest
Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →