Patent Assignment
Reel/Frame 017394/0302
Assignment of Assignor's Interest
Recorded: 2006-03-28
Pages: 3
Assignor
KIM, JAE-JUNE
Executed: 2005-10-07
Assignee
EASETECH KOREA CO., LTD.
ROOM 504, INSAGWAN, KANGNAM UNIVERSITY SAN 6-2, KUGALRI, KIHEUNGUB, YONGIN-SI, KYOUNGKI-DO 449-702, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Wafer Level Chip Scale Package Using Redistribution Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.