IP Library › Assignment 018446/0479
Patent Assignment
Reel/Frame 018446/0479

Assignment of Assignor's Interest

Recorded: 2006-10-27 Pages: 2
Assignor
CHOI, KYUNG JIN
Executed: 2006-10-26
Assignee
EPWORKS CO., LTD.
906, KOLON DIGITAL TOWER BILLANT 222-7, GURO-DONG, GURO-GU,, SEOUL, 152-050, KOREA, REPUBLIC OF
Covered Property (1)
Method for Manufacturing Wafer Level Chip Scale Package Using Redistribution Substrate
Patent: 7,264,995 →
Application: 11/245,962 →
Publication: US 2006/0079019
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 28, 2006
From: KIM, JAE-JUNE
To: EASETECH KOREA CO., LTD.
Reel/Frame 017394/0302 →
Assignment of Assignor's Interest Aug 5, 2006
From: EASETECH KOREA CO., LTD.
To: CHOI, KYUNG JIN
Reel/Frame 018058/0839 →