Patent Assignment
Reel/Frame 018058/0839
Assignment of Assignor's Interest
Recorded: 2006-08-05
Pages: 2
Assignor
EASETECH KOREA CO., LTD.
Executed: 2006-07-05
Assignee
CHOI, KYUNG JIN
206-402 JUGONG APT, UMAN 2-DONG, PALDAL-GU, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Wafer Level Chip Scale Package Using Redistribution Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.