Patent Assignment
Reel/Frame 017700/0810
Assignment of Assignor's Interest
Recorded: 2006-03-31
Pages: 3
Assignor
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Executed: 2006-03-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Properties
(3)
Dual band transmitting/receiving device
Application:
10/944,908 →
Publication:
US 2005/0064897
Integrated Circuit
High Frequency Module and Manufacturing Method Thereof
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 6, 2004
From: NOHARA, KAZUNORI; OKU, SETSUYA
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 015222/0330 →
Assignment of Assignor's Interest
Nov 5, 2004
From: HONDA, TAKANORI
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 015343/0963 →
Assignment of Assignor's Interest
Jan 7, 2005
From: MIYA, TATSUYA; KIMURA, KAZUHARU
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 015561/0794 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0840 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0975 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →