IP Library Assignment 017717/0170
Patent Assignment
Reel/Frame 017717/0170

Corrective Assignment to Correct the Corrective Assignment to Re-Record Assignment to Correct the Serial Number from 11383407 to 11383403 Previously Recorded on Reel 017703 Frame 0533. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2006-06-02 Pages: 6
Assignors
SHIM, IL KWON
Executed: 2006-05-19
HAN, BYUNG JOON
Executed: 2006-05-18
CHOW, SENG GUAN
Executed: 2006-05-18
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Offset Integrated Circuit Package-on-Package Stacking System
Patent: 7,518,224 →
Application: 11/383,403 →
Publication: US 2007/0108581
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319) Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →