Offset integrated circuit package-on-package stacking system
View Patent ↗An offset integrated circuit package-on-package stacking system is provided including providing a base substrate, forming a contact pad on the base substrate, mounting a first integrated circuit on the base substrate, forming a base package body around the first integrated circuit, providing an offset substrate, mounting a second integrated circuit on the offset substrate, and coupling the offset substrate to the contact pad, including placing the offset substrate on the base package body.
1. An offset integrated circuit package-on-package stacking system comprising:
providing a base substrate;
forming a contact pad on the base substrate;
mounting a first integrated circuit on the base substrate;
forming a base package body around the first integrated circuit;
providing an offset substrate;
mounting a second integrated circuit on the offset substrate; and
coupling the offset substrate to the contact pad, including placing the offset substrate over only a portion of the base package body to leave exposed a portion of the top of the base substrate.
2. The system as claimed in claim 1 further comprising mounting a passive component, an active component, or a combination thereof on the base substrate.
3. The system as claimed in claim 1 further comprising mounting an offset package on the base substrate with the offset package on the corner of a base mold cap.
4. The system as claimed in claim 1 further comprising providing a gap filler adhesive between the base package body and the offset substrate.
5. The system as claimed in claim 1 further comprising mounting an offset package on the base substrate with the offset package aligned with one edge of a base mold cap.
6. An offset integrated circuit package-on-package stacking system comprising:
providing a base substrate having system interconnects;
forming a contact pad on the base substrate;
mounting a first integrated circuit on the base substrate, including coupling the first integrated circuit to the contact pad;
forming a base package body around the first integrated circuit, including injecting a molding compound;
providing an offset substrate including providing the system interconnects, the offset substrate over only a portion of the base body package to leave exposed a portion of the top of the base substrate;
mounting a second integrated circuit on the offset substrate including forming an offset package body over the second integrated circuit; and
coupling the offset substrate to the contact pad, including placing the offset substrate on the base package body.
7. The system as claimed in claim 6 further comprising mounting a passive component, an active component, or a combination thereof on the base substrate, including coupling the passive component, the active component, or the combination thereof to the first integrated circuit, or the contact pads.
8. The system as claimed in claim 6 further comprising mounting an offset package on the base substrate with the offset package on the comer of a base mold cap, including providing an overlap region.
9. The system as claimed in claim 6 further comprising providing a gap filler adhesive between the base package body and the offset substrate, including providing a die attach material.
10. The system as claimed in claim 6 further comprising mounting an offset package on the base substrate with the offset package aligned with one edge of a base mold cap under the offset substrate.
11. An offset integrated circuit package-on-package stacking system comprising:
a base substrate;
a contact pad formed on the base substrate;
a first integrated circuit mounted on the base substrate;
a base package body molded around the first integrated circuit;
an offset substrate;
a second integrated circuit mounted on the offset substrate; and
the offset substrate coupled to the contact pad, includes the offset substrate placed over only a portion of the base package body to leave exposed a portion of the top of the base substrate.
12. The system as claimed in claim 11 further comprising a passive component, an active component, or a combination thereof mounted on the base substrate.
13. The system as claimed in claim 11 further comprising an offset package mounted on the base substrate with the offset package on the corner of a base mold cap.
14. The system as claimed in claim 11 further comprising a gap filler adhesive between the base package body and the offset substrate.
15. The system as claimed in claim 11 further comprising an offset package mounted on the base substrate with the offset package aligned with one edge of a base mold cap.
16. The system as claimed in claim 11 further comprising:
system interconnects on the base substrate;
the first integrated circuit coupled to the contact pad;
a molding compound injected around the first integrated circuit;
the system interconnects on the offset substrate; and
an offset package body formed over the second integrated circuit.
17. The system as claimed in claim 16 further comprising a passive component, an active component, or a combination thereof mounted on the base substrate, includes the passive component, the active component, or the combination thereof coupled to the first integrated circuit, or the contact pads.
18. The system as claimed in claim 16 further comprising a base mold cap under the offset package mounted on the base substrate, with the offset package on the corner of the base mold cap, includes an overlap region.
19. The system as claimed in claim 16 further comprising a gap filler adhesive between the base package body and the offset substrate, comprises a die attach material.
20. The system as claimed in claim 16 further comprising a base mold cap under the offset package mounted on the base substrate with the offset package aligned with one edge of the base mold cap.