IP Library Assignment 017883/0869
Patent Assignment
Reel/Frame 017883/0869

Assignment of Assignor's Interest

Recorded: 2006-05-09 Pages: 2
Assignors
HUANG, CHI HUNG
Executed: 2006-05-04
YOU, HSIEN-I
Executed: 2006-05-04
SHIH, MAO-YUAN
Executed: 2006-05-04
CHEN, CHIEN-JEN
Executed: 2006-05-04
Assignee
INSTRUMENT TECHNOLOGY RESEARCH CENTER, NATIONAL APPLIED RESEARCH LABORATORIES
NO. 20, R&D ROAD VI, HSINCHU SCIENCE BASED INDUSTRIAL PARK, HSINCHU-CITY, R.O.C., TAIWAN
Covered Property (1)
Method for Whole Field Thin Film Stress Evaluation
Patent: 7,403,270 →
Application: 11/430,449 →
Publication: US 2007/0017296
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 11, 2008
From: WANG, WEI-CHUNG
To: INSTRUMENT TECHNOLOGY RESEARCH CENTER, NATIONAL APPLIED RESEARCH LABORATORIES
Reel/Frame 021080/0214 →
Change of Name Aug 14, 2014
From: INSTRUMENT TECHNOLOGY RESEARCH CENTER, NATIONAL APPLIED RESEARCH LABORATORIES
To: NATIONAL APPLIED RESEARCH LABORATORIES
Reel/Frame 033534/0150 →