IP Library Assignment 017923/0494
Patent Assignment
Reel/Frame 017923/0494

Assignment of Assignor's Interest

Recorded: 2006-07-12 Pages: 5
Assignors
LEE, SANG-HO
Executed: 2006-06-27
HA, JONG-WOO
Executed: 2006-06-27
PARK, SOO-SAN
Executed: 2006-06-27
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Integrated Circuit Package System Including Wafer Level Spacer
Patent: 8,039,365 →
Application: 11/456,845 →
Publication: US 2008/0012095
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0272 →
Release of Security Interest Jun 9, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052879/0852 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0272. Assignor(S) Hereby Confirms the Assignment. Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0730 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →