IP Library › Assignment 017948/0134
Patent Assignment
Reel/Frame 017948/0134

Assignment of Assignor's Interest

Recorded: 2006-07-17 Pages: 3
Assignors
CHOW, SENG GUAN
Executed: 2006-07-07
KUAN, HEAP HOE
Executed: 2006-07-07
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Integrated Circuit Package System Employing an Exposed Thermally Conductive Coating
Patent: 8,124,460 →
Application: 11/458,078 →
Publication: US 2008/0012098
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0280 →
Release of Security Interest Jun 9, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052879/0852 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 38378 Frame: 0280) Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064789/0474 →
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 064789 Frame: 0474 Assignor(S) Hereby Confirms the Change of Name. Sep 8, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064842/0046 →