Integrated circuit package system employing an exposed thermally conductive coating
View Patent ↗An integrated circuit package system includes providing a leadframe that is coplanar with a bottom surface of the integrated circuit package system to which is attached a device with a thermally conductive coating that is coplanar with the bottom surface of the integrated circuit package system to the leadframe, the device having the characteristics of being singulated from a wafer and the thermally conductive coating having the characteristics of being singulated from a wafer level thermally conductive coating and encapsulating the device with an encapsulation material that leaves the thermally conductive coating exposed for thermal dissipation.
1. A method of manufacture of an integrated circuit package system comprising:
providing a planar leadframe;
attaching a device with a thermally conductive coating coplanar with the bottom surface of the leadframe to the leadframe, the device having the characteristics of being singulated from a wafer and the thermally conductive coating having the characteristics of being singulated from a wafer level thermally conductive coating; and
encapsulating the device with an encapsulation material leaving the thermally conductive coating exposed for thermal dissipation, the bottom surface of the encapsulation material coplanar with the bottom surface of the leadframe and the exposed surface of the thermally conductive coating.
2. The method as claimed in claim 1 further comprising:
configuring the thermally conductive coating to provide structural support to the device.
3. The method as claimed in claim 1 further comprising:
configuring the thermally conductive coating with a coefficient of thermal expansion similar to that of the device.
4. The method as claimed in claim 1 further comprising:
configuring the thermally conductive coating to include a solder wettable material.
5. The method as claimed in claim 1 further comprising:
processing the thermally conductive coating to prevent misalignment of the device.
6. An integrated circuit package system comprising:
a planar leadframe;
a device with a thermally conductive coating coplanar with the bottom surface of the leadframe attached to the leadframe, the device having the characteristics of being singulated from a wafer and the thermally conductive coating having the characteristics of being singulated from a wafer level thermally conductive coating; and
an encapsulation material encapsulating the device except for a portion of the thermally conductive coating exposed to an external environment for thermal dissipation, the bottom surface of the encapsulation material coplanar with the bottom surface of the leadframe and the exposed surface of the thermally conductive coating.
7. The system as claimed in claim 6 wherein:
the thermally conductive coating provides structural support to the device.
8. The system as claimed in claim 6 wherein:
the thermally conductive coating includes a coefficient of thermal expansion similar to that of the device.
9. The system as claimed in claim 6 wherein:
the thermally conductive coating is in direct contact with the device.
10. The system as claimed in claim 6 wherein:
the thermally conductive coating prevents misalignment of the device.
11. The system as claimed in claim 6 wherein:
the device includes semiconductor chips and integrated circuit packages.
12. The system as claimed in claim 6 wherein:
the thermally conductive coating includes thermally conductive pads.
13. The system as claimed in claim 6 wherein:
the thermally conductive coating is deposited to a thickness between about 5 and 15 micrometers.
14. The system as claimed in claim 6 wherein:
the thermally conductive coating includes a solder wettable material.
15. The system as claimed in claim 6 wherein:
the thermally conductive coating includes materials selected from aluminum, gold, copper or its alloy.